Introduction of Hot Press

Hot press is a kind of permanent electrical-mechanical connection equipment which heates two parts pre-coated with solder flux to a temperature sufficient to melt and flow solder, and solidifies them. The heating rate can be selected for different products. Titanium alloy indenter ensures average temperature, fast heating and long service life. The indenter is specially designed with adjustable level to ensure the average pressure of the components. Temperature numerical control, clear and precise. With digital pressure gauge, preset pressure range.

Hot press is also called bonding machine. According to the different media of hot pressing, it can be divided into tin soldering, ACF (heterodynamic tape), ACP (heterodynamic adhesive), TBF (hot melt adhesive film). Applicable to FPC (Flexible Circuit Board), HSC (Zebra Paper), TAB and LCD and PCB connections. As the Pitch of PCB or FPC in consumer electronic products tends to be smaller, the traditional tin soldering process has been difficult to meet the requirements of ultra-fine hot pressing. ACF process has been gradually applied by mobile phone designers.